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Chemical content 74LVC2G74GS

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Type numberPackagePackage descriptionTotal product weight
74LVC2G74GSSOT1203X2SON81.33459 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292799115612601235Suzhou, China; Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China; Ayutthaya, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04478100.000003.35531
subTotal0.04478100.000003.35531
ComponentAdditiveNon hazardousProprietary0.000305.000000.02248
FillerBisphenol A-epichlorohydrin resin25068-38-60.000305.000000.02248
Silica -amorphous-7631-86-90.0030050.000000.22479
PolymerEpoxy resin systemProprietary0.0018030.000000.13487
Phenol Formaldehyde resin (generic)9003-35-40.0006010.000000.04496
subTotal0.00600100.000000.44958
Lead FrameCopper alloyCopper (Cu)7440-50-80.5443894.5100040.78988
Magnesium (Mg)7439-95-40.000860.150000.06474
Nickel (Ni)7440-02-00.016992.950001.27320
Silicon (Si)7440-21-30.003690.640000.27622
Pure metal layerGold (Au)7440-57-50.000120.020000.00863
Nickel (Ni)7440-02-00.009451.640000.70781
Palladium (Pd)7440-05-30.000520.090000.03884
subTotal0.57600100.0000043.15932
Mould CompoundAdditiveNon hazardousProprietary0.002800.410000.20982
FillerSilica -amorphous-7631-86-90.001980.290000.14841
Silica fused60676-86-00.5884086.1500044.08878
HardenerPhenolic resinProprietary0.029304.290002.19548
PigmentCarbon black1333-86-40.001300.190000.09724
PolymerEpoxy resin systemProprietary0.059228.670004.43703
subTotal0.68300100.0000051.17676
WireGold alloyGold (Au)7440-57-50.0245799.000001.84078
Palladium (Pd)7440-05-30.000251.000000.01859
subTotal0.02482100.000001.85937
total1.33459100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.