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Chemical content 74LVC2G74GT

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Type numberPackagePackage descriptionTotal product weight
74LVC2G74GTSOT833-1XSON82.49387 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352803891151912601235Ayutthaya, Thailand; Bangkok, Thailand; Shanghai, China; Seremban, Malaysia; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08956100.000003.59118
subTotal0.08956100.000003.59118
ComponentAdditiveNon hazardousProprietary0.000755.000000.03007
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.03007
Silica -amorphous-7631-86-90.0075050.000000.30074
PolymerEpoxy resin systemProprietary0.0045030.000000.18044
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.06015
subTotal0.01500100.000000.60147
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.45447
Magnesium (Mg)7439-95-40.001530.145700.06152
Nickel (Ni)7440-02-00.030682.914001.23039
Silicon (Si)7440-21-30.006650.631400.26660
Pure metal layerGold (Au)7440-57-50.000370.035000.01478
Nickel (Ni)7440-02-00.028562.712001.14510
Palladium (Pd)7440-05-30.001260.120000.05067
subTotal1.05300100.0000042.22353
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21405
FillerSilica -amorphous-7631-86-90.003780.290000.15140
Silica fused60676-86-01.1216786.1500044.97720
HardenerPhenolic resinProprietary0.055864.290002.23972
PigmentCarbon black1333-86-40.002470.190000.09920
PolymerEpoxy resin systemProprietary0.112888.670004.52643
subTotal1.30200100.0000052.20800
WireGold alloyGold (Au)7440-57-50.0339799.000001.36202
Palladium (Pd)7440-05-30.000341.000000.01376
subTotal0.03431100.000001.37578
total2.49387100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.