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Chemical content 74LVC2GU04GM-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC2GU04GM-Q100SOT886XSON61.95778 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299056125912601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.09055100.000004.62534
subTotal0.09055100.000004.62534
ComponentAdditiveNon hazardousProprietary0.000255.000000.01277
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01277
Silica -amorphous-7631-86-90.0025050.000000.12770
PolymerEpoxy resin systemProprietary0.0015030.000000.07662
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02554
subTotal0.00500100.000000.25540
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.26758
Magnesium (Mg)7439-95-40.001160.150000.05915
Nickel (Ni)7440-02-00.022772.950001.16326
Silicon (Si)7440-21-30.004940.640000.25237
Pure metal layerGold (Au)7440-57-50.000150.020000.00789
Nickel (Ni)7440-02-00.012661.640000.64669
Palladium (Pd)7440-05-30.000690.090000.03549
subTotal0.77200100.0000039.43243
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22324
FillerSilica -amorphous-7631-86-90.003090.290000.15790
Silica fused60676-86-00.9183686.1500046.90818
HardenerPhenolic resinProprietary0.045734.290002.33588
PigmentCarbon black1333-86-40.002030.190000.10345
PolymerEpoxy resin systemProprietary0.092428.670004.72077
subTotal1.06600100.0000054.44942
WireGold alloyGold (Au)7440-57-50.0239999.000001.22525
Palladium (Pd)7440-05-30.000241.000000.01238
subTotal0.02423100.000001.23763
total1.95778100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.