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Chemical content 74LVC374ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC374ABQ-Q100SOT764-1DHVQFN2028.38034 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352993151155126030 s123520 s3Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00300
FillerSilver (Ag)7440-22-40.0639675.000000.22537
PolymerAcrylic resinProprietary0.005126.000000.01803
Resin systemProprietary0.0153518.000000.05409
subTotal0.08528100.000000.30049
DieDoped siliconSilicon (Si)7440-21-30.34464100.000001.21437
subTotal0.34464100.000001.21437
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700036.99207
Iron (Fe)7439-89-60.258502.400000.91085
Phosphorus (P)7723-14-00.003230.030000.01139
Zinc (Zn)7440-66-60.010770.100000.03795
subTotal10.77098100.0000037.95226
Mould CompoundAdditiveNon hazardousProprietary0.488632.984001.72171
FillerSilica -amorphous-7631-86-90.571483.490002.01366
Silica fused60676-86-013.8892184.8200048.93954
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.164081.002000.57814
PigmentCarbon black1333-86-40.026850.164000.09462
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.606043.701002.13541
Epoxy resin systemProprietary0.259711.586000.91509
Phenolic resinProprietary0.368932.253001.29994
subTotal16.37492100.0000057.69811
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07591
Nickel (Ni)7440-02-00.6628292.300002.33551
Palladium (Pd)7440-05-30.022263.100000.07844
Silver (Ag)7440-22-40.011491.600000.04049
subTotal0.71812100.000002.53035
WirePure metalCopper (Cu)7440-50-80.0834296.550000.29394
Pure metal layerGold (Au)7440-57-50.000300.350000.00107
Palladium (Pd)7440-05-30.002683.100000.00944
subTotal0.08640100.000000.30445
total28.38034100.00000100.00000
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