Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC594ABQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
93530223411574LVC594ABQ-Q100X74LVC594ABQ-Q100SOT763-1 (DHVQFN16)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 8919 ppm; substance 1333-86-4: 954 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 8919 ppm; substance 1333-86-4: 954 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 3498 ppm; substance 7440-05-3: 873 ppm; substance 7440-57-5: 108 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.07476075.0000000.349785
AdhesivePolymerResin system0.01794218.0000000.083946
AdhesivePolymerAcrylic resin0.0059816.0000000.027984
AdhesiveAdditiveNon-declarable0.0009971.0000000.004665
Adhesive Total0.099680100.0000000.466380
DieDoped siliconSilicon (Si)7440-21-30.312080100.0000001.460152
Die Total0.312080100.0000001.460152
Lead FrameCopper alloyCopper (Cu)7440-50-88.04341095.05689037.633312
Lead FrameCopper alloyIron (Fe)7439-89-60.1980522.3405850.926641
Lead FrameCopper alloyZinc (Zn)7440-66-60.0082520.0975200.038609
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0024760.0292600.011585
Base Alloy Total8.25219097.52425538.610147
Lead FramePure metal layerNickel (Ni)7440-02-00.1906362.2529320.891943
Pre-Plating 1 Total0.1906362.2529320.891943
Lead FramePure metal layerPalladium (Pd)7440-05-30.0167590.1980560.078412
Pre-Plating 2 Total0.0167590.1980560.078412
Lead FramePure metal layerGold (Au)7440-57-50.0020950.0247570.009802
Pre-Plating 3 Total0.0020950.0247570.009802
Lead Frame Total8.461680100.00000039.590304
Mould CompoundFillerSilica fused60676-86-010.55031084.82000049.362536
Mould CompoundPolymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603483.7010002.153865
Mould CompoundFillerSilica7631-86-90.4341033.4900002.031071
Mould CompoundAdditiveNon-declarable0.3711642.9840001.736593
Mould CompoundPolymerPhenolic resin0.2802392.2530001.311175
Mould CompoundPolymerEpoxy resin system0.1972741.5860000.923001
Mould CompoundAdditiveMisc. phosphorus compounds (generic) 0.1246331.0020000.583130
Mould CompoundPigmentCarbon black1333-86-40.0203990.1640000.095442
Mould Compound Total12.438470100.00000058.196813
WirePure metalCopper (Cu)7440-50-80.05909196.5500000.276474
WirePure metal layerGold (Au)7440-57-50.0002140.3500000.001001
Wire Coating 1 Total0.0002140.3500000.001001
WirePure metal layerPalladium (Pd)7440-05-30.0018973.1000000.008876
Wire Coating 2 Total0.0018973.1000000.008876
Wire Total0.061202100.0000000.286351
74LVC594ABQ-Q100 Total21.373112100.000000
Notes
Report created on 2025-05-06 15:24:18 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2025-05-06 15:24:18 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
基底合金 (Base Alloy)
预镀层1 (Pre-Plating 1)
预镀层2 (Pre-Plating 2)
预镀层3 (Pre-Plating 3)
模封料 (Mould Compound)
导线 (Wire)
导线涂层1 (Wire Coating 1)
导线涂层2 (Wire Coating 2)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2025-05-06 15:24:18 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.