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Chemical content 74LVC594ABQ

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Type numberPackagePackage descriptionTotal product weight
74LVC594ABQSOT763-1DHVQFN1621.99128 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352824661151312601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29503
PolymerResin systemProprietary0.0161219.900000.07330
subTotal0.08100100.000000.36833
DieDoped siliconSilicon (Si)7440-21-30.31208100.000001.41911
subTotal0.31208100.000001.41911
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.65592
Iron (Fe)7439-89-60.237082.320001.07807
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03717
Zinc (Zn)7440-66-60.012260.120000.05576
Gold alloyGold (Au)7440-57-50.003060.029970.01393
Silver (Ag)7440-22-40.002040.019980.00928
ImpurityNon hazardousProprietary0.000130.001280.00059
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02321
Nickel (Ni)7440-02-00.130671.278720.59420
subTotal10.21900100.0000046.46836
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.49766
FillerSilica -amorphous-7631-86-90.395003.490001.79616
Silica fused60676-86-09.5999384.8200043.65334
PigmentCarbon black1333-86-40.018110.160000.08235
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55583
Epoxy resin systemProprietary0.179961.590000.81831
Phenolic resinProprietary0.254662.250001.15798
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.90424
subTotal11.31800100.0000051.46587
WirePure metalCopper (Cu)7440-50-80.0590996.550000.26870
Pure metal layerGold (Au)7440-57-50.000210.350000.00097
Palladium (Pd)7440-05-30.001903.100000.00863
subTotal0.06120100.000000.27830
total21.99128100.00000100.00000
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