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Chemical content 74LVCH2T45GT

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Type numberPackagePackage descriptionTotal product weight
74LVCH2T45GTSOT833-1XSON82.52922 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352847621151312601235Nijmegen, Netherlands; Suzhou, China; Ayutthaya, Thailand; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.12058100.000004.76738
subTotal0.12058100.000004.76738
ComponentAdditiveNon hazardousProprietary0.000755.000000.02965
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.02965
Silica -amorphous-7631-86-90.0075050.000000.29653
PolymerEpoxy resin systemProprietary0.0045030.000000.17792
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.05931
subTotal0.01500100.000000.59306
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419038.90303
Magnesium (Mg)7439-95-40.001530.145700.06066
Nickel (Ni)7440-02-00.030682.914001.21320
Silicon (Si)7440-21-30.006650.631400.26287
Pure metal layerGold (Au)7440-57-50.000370.035000.01457
Nickel (Ni)7440-02-00.028562.712001.12910
Palladium (Pd)7440-05-30.001260.120000.04996
subTotal1.05300100.0000041.63339
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21106
FillerSilica -amorphous-7631-86-90.003780.290000.14929
Silica fused60676-86-01.1216786.1500044.34857
HardenerPhenolic resinProprietary0.055864.290002.20842
PigmentCarbon black1333-86-40.002470.190000.09781
PolymerEpoxy resin systemProprietary0.112888.670004.46317
subTotal1.30200100.0000051.47832
WireGold alloyGold (Au)7440-57-50.0382599.000001.51247
Palladium (Pd)7440-05-30.000391.000000.01528
subTotal0.03864100.000001.52775
total2.52922100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.