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Chemical content 74VHC595BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74VHC595BQ-Q100SOT763-1DHVQFN1621.74462 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935303191115512601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36719
PolymerResin systemProprietary0.0198419.900000.09122
subTotal0.09968100.000000.45841
DieDoped siliconSilicon (Si)7440-21-30.42185100.000001.94000
subTotal0.42185100.000001.94000
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.67424
Iron (Fe)7439-89-60.196362.400000.90303
Phosphorus (P)7723-14-00.002450.030000.01129
Zinc (Zn)7440-66-60.008180.100000.03763
subTotal8.18167100.0000037.62619
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.66459
FillerSilica -amorphous-7631-86-90.434103.490001.99637
Silica fused60676-86-010.5503184.8200048.51918
PigmentCarbon black1333-86-40.019900.160000.09152
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61779
Epoxy resin systemProprietary0.197771.590000.90952
Phenolic resinProprietary0.279872.250001.28706
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.11649
subTotal12.43847100.0000057.20252
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07526
Nickel (Ni)7440-02-00.5035192.300002.31554
Palladium (Pd)7440-05-30.016913.100000.07777
Silver (Ag)7440-22-40.008731.600000.04014
subTotal0.54551100.000002.50871
WirePure metalCopper (Cu)7440-50-80.0554796.550000.25508
Pure metal layerGold (Au)7440-57-50.000200.350000.00092
Palladium (Pd)7440-05-30.001783.100000.00819
subTotal0.05745100.000000.26419
total21.74462100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.