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Chemical content 74VHCT541BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74VHCT541BQ-Q100SOT764-1DHVQFN2028.36731 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300876115512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24080
PolymerResin systemProprietary0.0169719.900000.05982
subTotal0.08528100.000000.30062
DieDoped siliconSilicon (Si)7440-21-30.33003100.000001.16343
subTotal0.33003100.000001.16343
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700037.00906
Iron (Fe)7439-89-60.258502.400000.91127
Phosphorus (P)7723-14-00.003230.030000.01139
Zinc (Zn)7440-66-60.010770.100000.03797
subTotal10.77098100.0000037.96969
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.67979
FillerSilica -amorphous-7631-86-90.571483.490002.01459
Silica fused60676-86-013.8892184.8200048.96202
PigmentCarbon black1333-86-40.026200.160000.09236
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62343
Epoxy resin systemProprietary0.260361.590000.91782
Phenolic resinProprietary0.368442.250001.29880
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13581
subTotal16.37492100.0000057.72462
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07595
Nickel (Ni)7440-02-00.6628292.300002.33658
Palladium (Pd)7440-05-30.022263.100000.07848
Silver (Ag)7440-22-40.011491.600000.04050
subTotal0.71812100.000002.53151
WirePure metalCopper (Cu)7440-50-80.0849496.550000.29942
Pure metal layerGold (Au)7440-57-50.000310.350000.00109
Palladium (Pd)7440-05-30.002733.100000.00961
subTotal0.08797100.000000.31012
total28.36731100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.