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Chemical content AXP1T34GW

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Type numberPackagePackage descriptionTotal product weight
AXP1T34GWSOT353-1UMT55.67026 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691624125412601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12857
PolymerResin systemProprietary0.0024325.000000.04286
subTotal0.00972100.000000.17143
DieDoped siliconSilicon (Si)7440-21-30.07633100.000001.34616
subTotal0.07633100.000001.34616
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.64481
Iron (Fe)7439-89-60.045512.310000.80256
Lead (Pb)7439-92-10.000200.010000.00347
Phosphorus (P)7723-14-00.001380.070000.02432
Zinc (Zn)7440-66-60.002360.120000.04169
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22583
subTotal1.97000100.0000034.74268
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.12308
Silica fused60676-86-02.3217570.5700040.94615
PigmentCarbon black1333-86-40.006580.200000.11604
PolymerEpoxy resin systemProprietary0.305649.290005.39025
Phenolic resinProprietary0.195435.940003.44651
subTotal3.29000100.0000058.02203
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.46657
subTotal0.31000100.000005.46710
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0142099.990000.25048
subTotal0.01420100.000000.25051
total5.67026100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.