Chemical content BAS101S

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Type numberPackagePackage descriptionTotal product weight
BAS101SSOT23TO-236AB7.71684 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340608492151412601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia; Melaka, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10000100.000001.29587
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02973
Carbon (C)7440-44-00.001020.040000.01321
Chromium (Cr)7440-47-30.005610.220000.07267
Cobalt (Co)7440-48-40.010960.430000.14204
Iron (Fe)7439-89-61.2230147.9800015.84859
Manganese (Mn)7439-96-50.021920.860000.28407
Nickel (Ni)7440-02-00.9212136.1400011.93764
Phosphorus (P)7723-14-00.000510.020000.00661
Silicon (Si)7440-21-30.006630.260000.08588
Sulphur (S)7704-34-90.000510.020000.00661
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.75570
Silver (Ag)7440-22-40.065512.570000.84891
Mould CompoundAdditiveNon hazardousProprietary0.141492.900001.83354
FillerSilica -amorphous-7631-86-93.5128872.0000045.52226
PigmentCarbon black1333-86-40.002440.050000.03161
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7318515.000009.48380
Phenol Formaldehyde resin (generic)9003-35-40.4879010.000006.32254
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000100.055500.00133
Tin solderTin (Sn)7440-31-50.1848999.940002.39592
WirePure metalCopper (Cu)7440-50-80.00384100.000000.04972
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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