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Chemical content BAS116L

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Type numberPackagePackage descriptionTotal product weight
BAS116LSOD882DFN1006-20.91317 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069811315512601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.83227
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11466
Phenolic resinProprietary0.0013513.530000.14817
subTotal0.01000100.000001.09510
DieDoped siliconSilicon (Si)7440-21-30.02000100.000002.19017
subTotal0.02000100.000002.19017
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900042.42463
Magnesium (Mg)7439-95-40.000820.200000.08980
Nickel (Ni)7440-02-00.012923.150001.41430
Silicon (Si)7440-21-30.002830.690000.30980
Pure metal layerGold (Au)7440-57-50.000120.030000.01347
Nickel (Ni)7440-02-00.005211.270000.57021
Palladium (Pd)7440-05-30.000700.170000.07633
subTotal0.41000100.0000044.89854
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.33414
Silica fused60676-86-00.2700060.0000029.56733
Flame retardantMetal hydroxideProprietary0.013503.000001.47837
ImpurityBismuth (Bi)7440-69-90.002250.500000.24639
PigmentCarbon black1333-86-40.002250.500000.24639
PolymerEpoxy resin systemProprietary0.031507.000003.44952
Phenolic resinProprietary0.027006.000002.95673
subTotal0.45000100.0000049.27887
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00122
Tin solderTin (Sn)7440-31-50.0199999.940002.18886
subTotal0.02000100.000002.19018
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalGold (Au)7440-57-50.0031799.990000.34733
subTotal0.00317100.000000.34736
total0.91317100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.