×

Chemical content BAS116LS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS116LSSOD882BDDFN1006-20.88054 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663992315212601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.63990
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22592
Phenolic resinProprietary0.0025713.530000.29195
subTotal0.01900100.000002.15777
DieDoped siliconSilicon (Si)7440-21-30.02000100.000002.27133
subTotal0.02000100.000002.27133
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000042.88505
Magnesium (Mg)7439-95-40.000590.150000.06729
Nickel (Ni)7440-02-00.011772.980001.33679
Silicon (Si)7440-21-30.002570.650000.29158
Pure metal layerGold (Au)7440-57-50.000040.010000.00449
Nickel (Ni)7440-02-00.002250.570000.25570
Palladium (Pd)7440-05-30.000160.040000.01794
subTotal0.39500100.0000044.85884
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.83349
Silica fused60676-86-00.3387980.0920038.47516
PigmentCarbon black1333-86-40.003930.928000.44580
PolymerEpoxy resin systemProprietary0.035748.450004.05927
Phenolic resinProprietary0.010792.550001.22499
subTotal0.42300100.0000048.03871
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00126
Tin solderTin (Sn)7440-31-50.0199999.940002.26997
subTotal0.02000100.000002.27133
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0035499.990000.40176
subTotal0.00354100.000000.40180
total0.88054100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.