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Chemical content BAS16L-Q

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Type numberPackagePackage descriptionTotal product weight
BAS16L-QSOD882DFN1006-20.91366 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663920315112601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.83182
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11459
Phenolic resinProprietary0.0013513.530000.14809
subTotal0.01000100.000001.09450
DieDoped siliconSilicon (Si)7440-21-30.02000100.000002.18900
subTotal0.02000100.000002.18900
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900042.40188
Magnesium (Mg)7439-95-40.000820.200000.08975
Nickel (Ni)7440-02-00.012923.150001.41355
Silicon (Si)7440-21-30.002830.690000.30963
Pure metal layerGold (Au)7440-57-50.000120.030000.01346
Nickel (Ni)7440-02-00.005211.270000.56991
Palladium (Pd)7440-05-30.000700.170000.07629
subTotal0.41000100.0000044.87447
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.32807
Silica fused60676-86-00.2700060.0000029.55147
Flame retardantMetal hydroxideProprietary0.013503.000001.47757
ImpurityBismuth (Bi)7440-69-90.002250.500000.24626
PigmentCarbon black1333-86-40.002250.500000.24626
PolymerEpoxy resin systemProprietary0.031507.000003.44767
Phenolic resinProprietary0.027006.000002.95515
subTotal0.45000100.0000049.25245
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00121
Tin solderTin (Sn)7440-31-50.0199999.940002.18768
subTotal0.02000100.000002.18899
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0036699.990000.40055
subTotal0.00366100.000000.40059
total0.91366100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.