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Chemical content BAS16LD

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Type numberPackagePackage descriptionTotal product weight
BAS16LDSOD882DDFN1006-20.65905 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934064565315712601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.34595
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04766
Phenolic resinProprietary0.0004113.530000.06159
subTotal0.00300100.000000.45520
DieDoped siliconSilicon (Si)7440-21-30.02000100.000003.03467
subTotal0.02000100.000003.03467
Lead FrameCopper alloyChromium (Cr)7440-47-30.000800.257500.12190
Copper (Cu)7440-50-80.2957694.7950044.87678
Tin (Sn)7440-31-50.000750.238800.11305
Zinc (Zn)7440-66-60.000600.190800.09033
Pure metal layerGold (Au)7440-57-50.000170.055000.02604
Nickel (Ni)7440-02-00.013394.292002.03187
Palladium (Pd)7440-05-30.000530.170900.08091
subTotal0.31200100.0000047.34088
Mould CompoundFillerSilica -amorphous-7631-86-90.0687723.0000010.43472
Silica fused60676-86-00.1794060.0000027.22100
Flame retardantMetal hydroxideProprietary0.008973.000001.36105
ImpurityBismuth (Bi)7440-69-90.001500.500000.22684
PigmentCarbon black1333-86-40.001500.500000.22684
PolymerEpoxy resin systemProprietary0.020937.000003.17578
Phenolic resinProprietary0.017946.000002.72210
subTotal0.29900100.0000045.36833
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000010.055500.00185
Tin solderTin (Sn)7440-31-50.0219999.940003.33614
subTotal0.02200100.000003.33814
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0030599.990000.46274
subTotal0.00305100.000000.46279
total0.65905100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.