Chemical content BAS21H

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Type number	Package	Package description	Total product weight
BAS21H	SOD123F	SOD2	9.80862 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934059307115	18	1	260		1	235			Dongguan, China; Suqian, China; Melaka, Malaysia; D-22529 HAMBURG, Germany; Seremban, Malaysia

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	0.06000	100.00000	0.61171
		subTotal		0.06000	100.00000	0.61171

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	2.80917	96.86800	28.63983
		Iron (Fe)	7439-89-6	0.06235	2.15000	0.63567
		Phosphorus (P)	7723-14-0	0.00099	0.03400	0.01005
		Zinc (Zn)	7440-66-6	0.00371	0.12800	0.03784
	Pure metal layer	Silver (Ag)	7440-22-4	0.02378	0.82000	0.24244
		subTotal		2.90000	100.00000	29.56583

Mould Compound	Filler	Silica fused	60676-86-0	4.77120	71.00000	48.64293
	Pigment	Carbon black	1333-86-4	0.02016	0.30000	0.20553
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	1.32384	19.70000	13.49670
		Phenolic resin	Proprietary	0.60480	9.00000	6.16601
		subTotal		6.72000	100.00000	68.51117

Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.00001	0.00450	0.00006
		Non hazardous	Proprietary	0.00007	0.05550	0.00068
	Tin solder	Tin (Sn)	7440-31-5	0.11993	99.94000	1.22268
		subTotal		0.12000	100.00000	1.22342

Wire	Impurity	Non hazardous	Proprietary	0.00000	0.01000	0.00001
	Pure metal	Gold (Au)	7440-57-5	0.00862	99.99000	0.08791
		subTotal		0.00862	100.00000	0.08792

		total		9.80862	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.