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Chemical content BAS21QA

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Type numberPackagePackage descriptionTotal product weight
BAS21QASOT1215DFN1010D-31.14148 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070964147312601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000331.000000.02891
FillerSilver (Ag)7440-22-40.0277284.000002.42843
PolymerBismaleimidodiphenylmethane resin 0.0033010.000000.28910
Isobornyl Methacrylate7534-94-30.001655.000000.14455
subTotal0.03300100.000002.89099
DieDoped siliconSilicon (Si)7440-21-30.04000100.000003.50422
subTotal0.04000100.000003.50422
Lead FrameCopper alloyCopper (Cu)7440-50-80.4787591.5400041.94153
Magnesium (Mg)7439-95-40.000890.170000.07789
Nickel (Ni)7440-02-00.014912.850001.30580
Silicon (Si)7440-21-30.003240.620000.28407
Pure metal layerGold (Au)7440-57-50.000370.070000.03207
Nickel (Ni)7440-02-00.022754.350001.99307
Palladium (Pd)7440-05-30.002090.400000.18327
subTotal0.52300100.0000045.81770
Mould CompoundFillerSilica -amorphous-7631-86-90.1177623.0000010.31643
Silica fused60676-86-00.3072060.0000026.91243
Flame retardantMetal hydroxideProprietary0.015363.000001.34562
ImpurityBismuth (Bi)7440-69-90.002560.500000.22427
PigmentCarbon black1333-86-40.002560.500000.22427
PolymerEpoxy resin systemProprietary0.035847.000003.13978
Phenolic resinProprietary0.030726.000002.69124
subTotal0.51200100.0000044.85404
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00141
Tin solderTin (Sn)7440-31-50.0289899.940002.53904
subTotal0.02900100.000002.54056
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0044899.990000.39243
subTotal0.00448100.000000.39247
total1.14148100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.