Chemical content BAS30LS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

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Type number	Package	Package description	Total product weight
BAS30LS-Q	SOD882BD	DFN1006-2	0.89848 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934663829315	3	1	260		1	235			Dongguan, China; D-22529 HAMBURG, Germany

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	0.01444	76.00000	1.60716
	Polymer	Formaldehyde, polymer with (chloromethyl)oxirane and phenol	9003-36-5	0.00199	10.47000	0.22141
		Phenolic resin	Proprietary	0.00257	13.53000	0.28612
		subTotal		0.01900	100.00000	2.11469

Die	Doped silicon	Silicon (Si)	7440-21-3	0.03700	100.00000	4.11807
		subTotal		0.03700	100.00000	4.11807

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	0.37762	95.60000	42.02876
		Magnesium (Mg)	7439-95-4	0.00059	0.15000	0.06594
		Nickel (Ni)	7440-02-0	0.01177	2.98000	1.31010
		Silicon (Si)	7440-21-3	0.00257	0.65000	0.28576
	Pure metal layer	Gold (Au)	7440-57-5	0.00004	0.01000	0.00440
		Nickel (Ni)	7440-02-0	0.00225	0.57000	0.25059
		Palladium (Pd)	7440-05-3	0.00016	0.04000	0.01759
		subTotal		0.39500	100.00000	43.96314

Mould Compound	Filler	Silica -amorphous-	7631-86-9	0.03376	7.98000	3.75695
		Silica fused	60676-86-0	0.33879	80.09200	37.70692
	Pigment	Carbon black	1333-86-4	0.00393	0.92800	0.43690
	Polymer	Epoxy resin system	Proprietary	0.03574	8.45000	3.97822
		Phenolic resin	Proprietary	0.01079	2.55000	1.20053
		subTotal		0.42300	100.00000	47.07952

Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.00000	0.00450	0.00010
		Non hazardous	Proprietary	0.00001	0.05550	0.00124
	Tin solder	Tin (Sn)	7440-31-5	0.01999	99.94000	2.22465
		subTotal		0.02000	100.00000	2.22599

Wire	Impurity	Non hazardous	Proprietary	0.00000	0.01000	0.00005
	Pure metal	Gold (Au)	7440-57-5	0.00448	99.99000	0.49857
		subTotal		0.00448	100.00000	0.49862

		total		0.89848	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.