×

Chemical content BAS40DY

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS40DYSOT363SC-885.42425 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665751115212601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06000100.000001.10614
subTotal0.06000100.000001.10614
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03435
Carbon (C)7440-44-00.000830.040000.01526
Chromium (Cr)7440-47-30.004350.210000.08014
Cobalt (Co)7440-48-40.008900.430000.16410
Iron (Fe)7439-89-60.9811847.4000018.08877
Manganese (Mn)7439-96-50.017600.850000.32438
Nickel (Ni)7440-02-00.7392035.7100013.62764
Phosphorus (P)7723-14-00.000410.020000.00763
Silicon (Si)7440-21-30.005380.260000.09922
Sulphur (S)7704-34-90.000410.020000.00763
Pure metal layerCopper (Cu)7440-50-80.2713813.110005.00303
Silver (Ag)7440-22-40.038501.860000.70981
subTotal2.07000100.0000038.16196
Mould CompoundFillerSilica fused60676-86-02.1929275.1000040.42808
PigmentCarbon black1333-86-40.008760.300000.16150
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5110017.500009.42066
Phenol Formaldehyde resin (generic)9003-35-40.207327.100003.82210
subTotal2.92000100.0000053.83234
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.82054
subTotal0.37000100.000006.82122
WirePure metalCopper (Cu)7440-50-80.00425100.000000.07829
subTotal0.00425100.000000.07829
total5.42425100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.