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Chemical content BAS40L

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Type numberPackagePackage descriptionTotal product weight
BAS40LSOD882DFN1006-20.93360 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340572533151512601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.81405
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11215
Phenolic resinProprietary0.0013513.530000.14492
subTotal0.01000100.000001.07112
DieDoped siliconSilicon (Si)7440-21-30.04000100.000004.28449
subTotal0.04000100.000004.28449
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.49625
Magnesium (Mg)7439-95-40.000820.200000.08783
Nickel (Ni)7440-02-00.012923.150001.38335
Silicon (Si)7440-21-30.002830.690000.30302
Pure metal layerGold (Au)7440-57-50.000120.030000.01317
Nickel (Ni)7440-02-00.005211.270000.55773
Palladium (Pd)7440-05-30.000700.170000.07466
subTotal0.41000100.0000043.91601
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.08612
Silica fused60676-86-00.2700060.0000028.92031
Flame retardantMetal hydroxideProprietary0.013503.000001.44602
ImpurityBismuth (Bi)7440-69-90.002250.500000.24100
PigmentCarbon black1333-86-40.002250.500000.24100
PolymerEpoxy resin systemProprietary0.031507.000003.37404
Phenolic resinProprietary0.027006.000002.89203
subTotal0.45000100.0000048.20052
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00119
Tin solderTin (Sn)7440-31-50.0199999.940002.14096
subTotal0.02000100.000002.14225
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0036099.990000.38546
subTotal0.00360100.000000.38550
total0.93360100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.