×

Chemical content BAS521

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS521SOD523SC-791.48477 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934057766315512601235Dongguan, China; Melaka, Malaysia; D-22529 HAMBURG, Germany; Seremban, Malaysia 
934057766135612601235D-22529 HAMBURG, Germany; Melaka, Malaysia; Dongguan, China; Seremban, Malaysia 
9340577661151612601235Dongguan, China; Seremban, Malaysia; Melaka, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000003.36752
subTotal0.05000100.000003.36752
Lead FrameCopper alloyCopper (Cu)7440-50-80.5177197.6817334.86824
Iron (Fe)7439-89-60.011402.150000.76746
Phosphorus (P)7723-14-00.000180.034000.01214
Zinc (Zn)7440-66-60.000570.108000.03855
ImpurityLead (Pb)7439-92-10.000010.001270.00045
Pure metal layerCopper (Cu)7440-50-80.000030.005000.00178
Silver (Ag)7440-22-40.000110.020000.00714
subTotal0.53000100.0000035.69576
Mould CompoundFillerSilica fused60676-86-00.6248071.0000042.08059
PigmentCarbon black1333-86-40.002640.300000.17781
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.1733619.7000011.67588
Phenolic resinProprietary0.079209.000005.33416
subTotal0.88000100.0000059.26844
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00006
Non hazardousProprietary0.000010.055500.00075
Tin solderTin (Sn)7440-31-50.0199999.940001.34620
subTotal0.02000100.000001.34701
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalGold (Au)7440-57-50.0047799.990000.32150
subTotal0.00477100.000000.32153
total1.48477100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.