Chemical content BAS70-06W

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

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Type number	Package	Package description	Total product weight
BAS70-06W	SOT323	SC-70	5.68306 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934034500115	14	1	260		1	235			Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	0.06000	100.00000	1.05577
		subTotal		0.06000	100.00000	1.05577

Lead Frame	Iron-nickel alloy	Aluminium (Al)	7429-90-5	0.00203	0.10000	0.03576
		Carbon (C)	7440-44-0	0.00102	0.05000	0.01788
		Chromium (Cr)	7440-47-3	0.00203	0.10000	0.03576
		Cobalt (Co)	7440-48-4	0.01016	0.50000	0.17878
		Iron (Fe)	7439-89-6	1.05054	51.70000	18.48553
		Manganese (Mn)	7439-96-5	0.01626	0.80000	0.28604
		Nickel (Ni)	7440-02-0	0.81280	40.00000	14.30215
		Phosphorus (P)	7723-14-0	0.00051	0.02500	0.00894
		Silicon (Si)	7440-21-3	0.00610	0.30000	0.10727
		Sulphur (S)	7704-34-9	0.00051	0.02500	0.00894
	Pure metal layer	Copper (Cu)	7440-50-8	0.08941	4.40000	1.57324
		Silver (Ag)	7440-22-4	0.04064	2.00000	0.71511
		subTotal		2.03200	100.00000	35.75540

Mould Compound	Filler	Silica fused	60676-86-0	2.39270	71.00000	42.10232
	Pigment	Carbon black	1333-86-4	0.01011	0.30000	0.17790
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	0.66389	19.70000	11.68191
		Phenolic resin	Proprietary	0.30330	9.00000	5.33691
		subTotal		3.37000	100.00000	59.29904

Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.00001	0.00300	0.00011
		Bismuth (Bi)	7440-69-9	0.00000	0.00100	0.00004
		Copper (Cu)	7440-50-8	0.00000	0.00100	0.00004
		Lead (Pb)	7439-92-1	0.00001	0.00500	0.00018
	Tin solder	Tin (Sn)	7440-31-5	0.20998	99.99000	3.69482
		subTotal		0.21000	100.00000	3.69519

Wire	Pure metal	Gold (Au)	7440-57-5	0.01106	100.00000	0.19461
		subTotal		0.01106	100.00000	0.19461

		total		5.68306	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.