Chemical content BAS70L-Q

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Type numberPackagePackage descriptionTotal product weight
BAS70L-QSOD882DFN1006-20.91360 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934664516315112601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.83187
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11460
Phenolic resinProprietary0.0013513.530000.14810
DieDoped siliconSilicon (Si)7440-21-30.02000100.000002.18914
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900042.40466
Magnesium (Mg)7439-95-40.000820.200000.08975
Nickel (Ni)7440-02-00.012923.150001.41364
Silicon (Si)7440-21-30.002830.690000.30965
Pure metal layerGold (Au)7440-57-50.000120.030000.01346
Nickel (Ni)7440-02-00.005211.270000.56994
Palladium (Pd)7440-05-30.000700.170000.07629
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.32881
Silica fused60676-86-00.2700060.0000029.55342
Flame retardantMetal hydroxideProprietary0.013503.000001.47767
ImpurityBismuth (Bi)7440-69-90.002250.500000.24628
PigmentCarbon black1333-86-40.002250.500000.24628
PolymerEpoxy resin systemProprietary0.031507.000003.44790
Phenolic resinProprietary0.027006.000002.95534
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00121
Tin solderTin (Sn)7440-31-50.0199999.940002.18783
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0036099.990000.39390
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.