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Chemical content BAT32ALS

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Type numberPackagePackage descriptionTotal product weight
BAT32ALSSOD882BDDFN1006-20.90399 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663990315212601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.59736
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22006
Phenolic resinProprietary0.0025713.530000.28437
subTotal0.01900100.000002.10179
DieDoped siliconSilicon (Si)7440-21-30.03800100.000004.20359
subTotal0.03800100.000004.20359
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000041.77259
Magnesium (Mg)7439-95-40.000590.150000.06554
Nickel (Ni)7440-02-00.011772.980001.30212
Silicon (Si)7440-21-30.002570.650000.28402
Pure metal layerGold (Au)7440-57-50.000040.010000.00437
Nickel (Ni)7440-02-00.002250.570000.24906
Palladium (Pd)7440-05-30.000160.040000.01748
subTotal0.39500100.0000043.69518
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.73405
Silica fused60676-86-00.3387980.0920037.47709
PigmentCarbon black1333-86-40.003930.928000.43423
PolymerEpoxy resin systemProprietary0.035748.450003.95397
Phenolic resinProprietary0.010792.550001.19321
subTotal0.42300100.0000046.79255
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00123
Tin solderTin (Sn)7440-31-50.0199999.940002.21109
subTotal0.02000100.000002.21242
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0044899.990000.49553
subTotal0.00448100.000000.49558
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0045199.990000.49863
subTotal0.00451100.000000.49868
total0.90399100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.