×

Chemical content BAT46GW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT46GWSOD123SOD212.10626 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070363115212601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany; Melaka, Malaysia 
934070363118312601235Melaka, Malaysia; Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08000100.000000.66082
subTotal0.08000100.000000.66082
Lead FrameCopper alloyCopper (Cu)7440-50-83.5331894.4700029.18472
Iron (Fe)7439-89-60.077792.080000.64258
Phosphorus (P)7723-14-00.001500.040000.01236
Zinc (Zn)7440-66-60.004860.130000.04016
Pure metal layerCopper (Cu)7440-50-80.062461.670000.51591
Silver (Ag)7440-22-40.060211.610000.49738
subTotal3.74000100.0000030.89311
Mould CompoundAdditiveNon hazardousProprietary0.234032.900001.93313
Triphenylphosphine603-35-00.004040.050000.03333
FillerSilica -amorphous-7631-86-95.8104072.0000047.99500
PigmentCarbon black1333-86-40.004040.050000.03333
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2105015.000009.99896
Phenol Formaldehyde resin (generic)9003-35-40.8070010.000006.66597
subTotal8.07000100.0000066.65972
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00008
Non hazardousProprietary0.000120.055500.00096
Tin solderTin (Sn)7440-31-50.2098799.940001.73360
subTotal0.21000100.000001.73464
WirePure metalCopper (Cu)7440-50-80.00626100.000000.05169
subTotal0.00626100.000000.05169
total12.10626100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.