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Chemical content BAT54L

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Type numberPackagePackage descriptionTotal product weight
BAT54LSOD882DFN1006-20.92366 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340572483151512601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.82281
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11335
Phenolic resinProprietary0.0013513.530000.14648
subTotal0.01000100.000001.08264
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.24795
subTotal0.03000100.000003.24795
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.94281
Magnesium (Mg)7439-95-40.000820.200000.08878
Nickel (Ni)7440-02-00.012923.150001.39824
Silicon (Si)7440-21-30.002830.690000.30628
Pure metal layerGold (Au)7440-57-50.000120.030000.01332
Nickel (Ni)7440-02-00.005211.270000.56374
Palladium (Pd)7440-05-30.000700.170000.07546
subTotal0.41000100.0000044.38863
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.20542
Silica fused60676-86-00.2700060.0000029.23154
Flame retardantMetal hydroxideProprietary0.013503.000001.46158
ImpurityBismuth (Bi)7440-69-90.002250.500000.24360
PigmentCarbon black1333-86-40.002250.500000.24360
PolymerEpoxy resin systemProprietary0.031507.000003.41035
Phenolic resinProprietary0.027006.000002.92315
subTotal0.45000100.0000048.71924
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00120
Tin solderTin (Sn)7440-31-50.0199999.940002.16400
subTotal0.02000100.000002.16530
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0036699.990000.39621
subTotal0.00366100.000000.39625
total0.92366100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.