Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAT54QC-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT54QC-QSOT8009DFN1412D-32.45666 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662723147112601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0053276.000000.21655
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0007310.470000.02983
Phenolic resinProprietary0.0009513.530000.03855
subTotal0.00700100.000000.28493
DieDoped siliconSilicon (Si)7440-21-30.01400100.000000.56988
subTotal0.01400100.000000.56988
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792044.34887
Magnesium (Mg)7439-95-40.001700.145400.06913
Nickel (Ni)7440-02-00.033982.908901.38301
Silicon (Si)7440-21-30.007360.630300.29967
Pure metal layerGold (Au)7440-57-50.000440.037300.01773
Nickel (Ni)7440-02-00.033552.872201.36557
Palladium (Pd)7440-05-30.001480.126700.06024
subTotal1.16800100.0000047.54422
Mould CompoundAdditiveNon hazardousProprietary0.004850.410000.19727
FillerSilica -amorphous-7631-86-90.003430.290000.13953
Silica fused60676-86-01.0182986.1500041.45030
HardenerPhenolic resinProprietary0.050714.290002.06410
PigmentCarbon black1333-86-40.002250.190000.09142
PolymerEpoxy resin systemProprietary0.102488.670004.17149
subTotal1.18200100.0000048.11411
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000050.055500.00188
Tin solderTin (Sn)7440-31-50.0829599.940003.37654
subTotal0.08300100.000003.37857
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0026699.990000.10843
subTotal0.00266100.000000.10844
total2.45666100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.