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Chemical content BAT54W

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT54WSOT323SC-705.51309 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934028880135412601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
9340288801151212601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03000100.000000.54416
subTotal0.03000100.000000.54416
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001660.090000.03020
Carbon (C)7440-44-00.000740.040000.01342
Chromium (Cr)7440-47-30.001660.090000.03020
Cobalt (Co)7440-48-40.007960.430000.14429
Iron (Fe)7439-89-60.8260244.6500014.98298
Manganese (Mn)7439-96-50.012760.690000.23154
Nickel (Ni)7440-02-00.6389934.5400011.59041
Phosphorus (P)7723-14-00.000370.020000.00671
Silicon (Si)7440-21-30.004810.260000.08725
Sulphur (S)7704-34-90.000370.020000.00671
Pure metal layerCopper (Cu)7440-50-80.3117216.850005.65427
Silver (Ag)7440-22-40.042922.320000.77851
subTotal1.85000100.0000033.55649
Mould CompoundFillerSilica fused60676-86-02.5534075.1000046.31522
PigmentCarbon black1333-86-40.010200.300000.18501
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5950017.5000010.79250
Phenol Formaldehyde resin (generic)9003-35-40.241407.100004.37867
subTotal3.40000100.0000061.67140
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00021
Tin solderTin (Sn)7440-31-50.2299899.990004.17147
subTotal0.23000100.000004.17189
WirePure metalCopper (Cu)7440-50-80.00309100.000000.05608
subTotal0.00309100.000000.05608
total5.51309100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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