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Chemical content BAT720

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT720SOT23TO-236AB7.79155 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340512802351112601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
9340512802151412601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.16000100.000002.05351
subTotal0.16000100.000002.05351
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02944
Carbon (C)7440-44-00.001020.040000.01309
Chromium (Cr)7440-47-30.005610.220000.07197
Cobalt (Co)7440-48-40.010960.430000.14067
Iron (Fe)7439-89-61.2230147.9800015.69662
Manganese (Mn)7439-96-50.021920.860000.28135
Nickel (Ni)7440-02-00.9212136.1400011.82318
Phosphorus (P)7723-14-00.000510.020000.00654
Silicon (Si)7440-21-30.006630.260000.08506
Sulphur (S)7704-34-90.000510.020000.00654
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.71969
Silver (Ag)7440-22-40.065512.570000.84077
subTotal2.54900100.0000032.71492
Mould CompoundAdditiveNon hazardousProprietary0.141492.900001.81595
Triphenylphosphine603-35-00.002440.050000.03131
FillerSilica -amorphous-7631-86-93.5128872.0000045.08577
PigmentCarbon black1333-86-40.002440.050000.03131
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7318515.000009.39287
Phenol Formaldehyde resin (generic)9003-35-40.4879010.000006.26191
subTotal4.87900100.0000062.61912
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000100.055500.00132
Tin solderTin (Sn)7440-31-50.1848999.940002.37294
subTotal0.18500100.000002.37437
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0185599.990000.23805
subTotal0.01855100.000000.23807
total7.79155100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.