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Chemical content BAV70QA

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Type numberPackagePackage descriptionTotal product weight
BAV70QASOT1215DFN1010D-31.14516 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069813147312601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000331.000000.02882
FillerSilver (Ag)7440-22-40.0277284.000002.42062
PolymerBismaleimidodiphenylmethane resin 0.0033010.000000.28817
Isobornyl Methacrylate7534-94-30.001655.000000.14408
subTotal0.03300100.000002.88169
DieDoped siliconSilicon (Si)7440-21-30.04000100.000003.49296
subTotal0.04000100.000003.49296
Lead FrameCopper alloyCopper (Cu)7440-50-80.4787591.5400041.80675
Magnesium (Mg)7439-95-40.000890.170000.07764
Nickel (Ni)7440-02-00.014912.850001.30161
Silicon (Si)7440-21-30.003240.620000.28316
Pure metal layerGold (Au)7440-57-50.000370.070000.03197
Nickel (Ni)7440-02-00.022754.350001.98667
Palladium (Pd)7440-05-30.002090.400000.18268
subTotal0.52300100.0000045.67048
Mould CompoundFillerSilica -amorphous-7631-86-90.1177623.0000010.28328
Silica fused60676-86-00.3072060.0000026.82595
Flame retardantMetal hydroxideProprietary0.015363.000001.34130
ImpurityBismuth (Bi)7440-69-90.002560.500000.22355
PigmentCarbon black1333-86-40.002560.500000.22355
PolymerEpoxy resin systemProprietary0.035847.000003.12969
Phenolic resinProprietary0.030726.000002.68259
subTotal0.51200100.0000044.70991
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00141
Tin solderTin (Sn)7440-31-50.0289899.940002.53088
subTotal0.02900100.000002.53240
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0081699.990000.71249
subTotal0.00816100.000000.71256
total1.14516100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.