Chemical content BAW56M

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Type numberPackagePackage descriptionTotal product weight
BAW56Mdummy POV SOT883XQFN30.86672 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340612713151312601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.87687
PolymerPhenolic resinProprietary0.0013513.530000.15611
Formaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.12080
DieDoped siliconSilicon (Si)7440-21-30.04000100.000004.61510
Lead FrameCopper alloySilicon (Si)7440-21-30.002710.631000.31305
Copper (Cu)7440-50-80.4016693.4100046.34288
Magnesium (Mg)7439-95-40.000630.146000.07243
Nickel (Ni)7440-02-00.012532.913001.44521
MetallisationPalladium (Pd)7440-05-30.000470.110000.05457
Gold (Au)7440-57-50.000150.035000.01736
Nickel (Ni)7440-02-00.011852.755001.36682
Mould CompoundFillerSilica fused60676-86-00.2220060.0000025.61381
Silica -amorphous-7631-86-90.0851023.000009.81863
Flame retardantMetal hydroxideProprietary0.011103.000001.28069
ImpurityBismuth (Bi)7440-69-90.001850.500000.21345
PigmentCarbon black1333-86-40.001850.500000.21345
PolymerEpoxy resin systemProprietary0.025907.000002.98828
Phenolic resinProprietary0.022206.000002.56138
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00064
Tin solderTin (Sn)7440-31-50.0099999.940001.15308
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0067299.990000.77526
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.