Chemical content BAW56QA

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Type numberPackagePackage descriptionTotal product weight
BAW56QASOT1215DFN1010D-31.14764 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934069812147312601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000331.000000.02875
FillerSilver (Ag)7440-22-40.0277284.000002.41539
PolymerBismaleimidodiphenylmethane resin 0.0033010.000000.28755
Isobornyl Methacrylate7534-94-30.001655.000000.14377
DieDoped siliconSilicon (Si)7440-21-30.04000100.000003.48541
Lead FrameCopper alloyCopper (Cu)7440-50-80.4787591.5400041.71641
Magnesium (Mg)7439-95-40.000890.170000.07747
Nickel (Ni)7440-02-00.014912.850001.29880
Silicon (Si)7440-21-30.003240.620000.28255
Pure metal layerGold (Au)7440-57-50.000370.070000.03190
Nickel (Ni)7440-02-00.022754.350001.98237
Palladium (Pd)7440-05-30.002090.400000.18229
Mould CompoundFillerSilica -amorphous-7631-86-90.1177623.0000010.26106
Silica fused60676-86-00.3072060.0000026.76798
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.015363.000001.33840
Ion trapping agentBismuth (Bi)7440-69-90.002560.500000.22307
PigmentCarbon black1333-86-40.002560.500000.22307
PolymerEpoxy resin systemProprietary0.035847.000003.12293
Phenolic resinProprietary0.030726.000002.67680
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00140
Tin solderTin (Sn)7440-31-50.0289899.940002.52541
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalGold (Au)7440-57-50.0106499.990000.92703
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.