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Chemical content BAW56SRA

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Type numberPackagePackage descriptionTotal product weight
BAW56SRASOT1268-1DFN1412-62.38987 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070159147312601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1064076.000004.45213
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0146610.470000.61334
Phenolic resinProprietary0.0189413.530000.79260
subTotal0.14000100.000005.85807
DieDoped siliconSilicon (Si)7440-21-30.08000100.000003.34746
subTotal0.08000100.000003.34746
Lead FrameCopper alloyCopper (Cu)7440-50-80.9185195.6780038.43342
Magnesium (Mg)7439-95-40.001430.149200.05993
Nickel (Ni)7440-02-00.028642.983701.19854
Silicon (Si)7440-21-30.006210.646500.25970
Pure metal layerGold (Au)7440-57-50.000110.011400.00458
Nickel (Ni)7440-02-00.004760.495500.19904
Palladium (Pd)7440-05-30.000340.035700.01434
subTotal0.96000100.0000040.16955
Mould CompoundFillerSilica -amorphous-7631-86-90.2599023.0000010.87507
Silica fused60676-86-00.6780060.0000028.36974
Flame retardantMetal hydroxideProprietary0.033903.000001.41849
ImpurityBismuth (Bi)7440-69-90.005650.500000.23641
PigmentCarbon black1333-86-40.005650.500000.23641
PolymerEpoxy resin systemProprietary0.079107.000003.30980
Phenolic resinProprietary0.067806.000002.83697
subTotal1.13000100.0000047.28289
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000030.055500.00116
Tin solderTin (Sn)7440-31-50.0499799.940002.09091
subTotal0.05000100.000002.09216
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0298799.990001.24982
subTotal0.02987100.000001.24994
total2.38987100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.