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Chemical content BC53PA

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Type numberPackagePackage descriptionTotal product weight
BC53PASOT1061HUSON37.56463 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340658211155126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01454
FillerSilver (Ag)7440-22-40.0924084.000001.22147
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14541
Isobornyl Methacrylate7534-94-30.005505.000000.07271
subTotal0.11000100.000001.45413
DieDoped siliconSilicon (Si)7440-21-30.20000100.000002.64388
subTotal0.20000100.000002.64388
Lead FrameCopper alloyCopper (Cu)7440-50-82.6413794.2000034.91735
Magnesium (Mg)7439-95-40.008410.300000.11120
Nickel (Ni)7440-02-00.098143.500001.29735
Silicon (Si)7440-21-30.024390.870000.32249
Pure metal layerGold (Au)7440-57-50.001120.040000.01483
Nickel (Ni)7440-02-00.028041.000000.37067
Palladium (Pd)7440-05-30.002520.090000.03336
subTotal2.80400100.0000037.06725
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.23089
FillerSilica -amorphous-7631-86-90.012350.290000.16331
Silica fused60676-86-03.6699986.1500048.51513
HardenerPhenolic resinProprietary0.182754.290002.41590
PigmentCarbon black1333-86-40.008090.190000.10700
PolymerEpoxy resin systemProprietary0.369348.670004.88249
subTotal4.26000100.0000056.31472
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00125
Tin solderTin (Sn)7440-31-50.1699099.940002.24595
subTotal0.17000100.000002.24730
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0206399.990000.27266
subTotal0.02063100.000000.27269
total7.56463100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.