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Chemical content BC807-40QB

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Type numberPackagePackage descriptionTotal product weight
BC807-40QBSOT8015DFN1110D-31.65251 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660964147512601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0053276.000000.32193
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0007310.470000.04435
Phenolic resinProprietary0.0009513.530000.05731
subTotal0.00700100.000000.42359
DieDoped siliconSilicon (Si)7440-21-30.08000100.000004.84112
subTotal0.08000100.000004.84112
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860043.49787
Magnesium (Mg)7439-95-40.001120.149000.06780
Nickel (Ni)7440-02-00.022422.980901.35650
Silicon (Si)7440-21-30.004860.645900.29393
Pure metal layerGold (Au)7440-57-50.000060.007700.00350
Nickel (Ni)7440-02-00.004470.594000.27031
Palladium (Pd)7440-05-30.000270.036500.01661
subTotal0.75200100.0000045.50652
Mould CompoundFillerSilica -amorphous-7631-86-90.060017.980003.63142
Silica fused60676-86-00.6022980.0920036.44709
PigmentCarbon black1333-86-40.006980.928000.42230
PolymerEpoxy resin systemProprietary0.063548.450003.84530
Phenolic resinProprietary0.019182.550001.16042
subTotal0.75200100.0000045.50653
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00191
Tin solderTin (Sn)7440-31-50.0569799.940003.44723
subTotal0.05700100.000003.44930
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0045199.990000.27313
subTotal0.00451100.000000.27316
total1.65251100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.