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Chemical content BC817-25QB-Q

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Type numberPackagePackage descriptionTotal product weight
BC817-25QB-QSOT8015DFN1110D-31.62459 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662974147112601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0045676.000000.28069
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0006310.470000.03867
Phenolic resinProprietary0.0008113.530000.04997
subTotal0.00600100.000000.36933
DieDoped siliconSilicon (Si)7440-21-30.06000100.000003.69324
subTotal0.06000100.000003.69324
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860044.24542
Magnesium (Mg)7439-95-40.001120.149000.06897
Nickel (Ni)7440-02-00.022422.980901.37982
Silicon (Si)7440-21-30.004860.645900.29898
Pure metal layerGold (Au)7440-57-50.000060.007700.00356
Nickel (Ni)7440-02-00.004470.594000.27495
Palladium (Pd)7440-05-30.000270.036500.01690
subTotal0.75200100.0000046.28860
Mould CompoundAdditiveNon hazardousProprietary0.003050.410000.18802
FillerSilica -amorphous-7631-86-90.002160.290000.13299
Silica fused60676-86-00.6418286.1500039.50643
HardenerPhenolic resinProprietary0.031964.290001.96730
PigmentCarbon black1333-86-40.001420.190000.08713
PolymerEpoxy resin systemProprietary0.064598.670003.97586
subTotal0.74500100.0000045.85773
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00195
Tin solderTin (Sn)7440-31-50.0569799.940003.50647
subTotal0.05700100.000003.50858
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0045999.990000.28238
subTotal0.00459100.000000.28241
total1.62459100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.