Chemical content BC817-40QCH-Q

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Type numberPackagePackage descriptionTotal product weight
BC817-40QCH-QSOT8009DFN1412D-32.50566 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346643071472126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0053276.000000.21232
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0007310.470000.02925
Phenolic resinProprietary0.0009513.530000.03780
DieDoped siliconSilicon (Si)7440-21-30.06000100.000002.39458
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792043.48160
Magnesium (Mg)7439-95-40.001700.145400.06778
Nickel (Ni)7440-02-00.033982.908901.35597
Silicon (Si)7440-21-30.007360.630300.29381
Pure metal layerGold (Au)7440-57-50.000440.037300.01739
Nickel (Ni)7440-02-00.033552.872201.33886
Palladium (Pd)7440-05-30.001480.126700.05906
Mould CompoundAdditiveNon hazardousProprietary0.004850.410000.19341
FillerSilica -amorphous-7631-86-90.003430.290000.13680
Silica fused60676-86-01.0182986.1500040.63971
HardenerPhenolic resinProprietary0.050714.290002.02373
PigmentCarbon black1333-86-40.002250.190000.08963
PolymerEpoxy resin systemProprietary0.102488.670004.08992
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000050.055500.00184
Tin solderTin (Sn)7440-31-50.0829599.940003.31051
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0056699.990000.22591
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.