Chemical content BC817RA

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Type numberPackagePackage descriptionTotal product weight
BC817RASOT1268-1DFN1412-62.39600 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934070165147312601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1064076.000004.44073
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0146610.470000.61177
Phenolic resinProprietary0.0189413.530000.79057
DieDoped siliconSilicon (Si)7440-21-30.10000100.000004.17362
Lead FrameCopper alloyCopper (Cu)7440-50-80.9185195.6780038.33509
Magnesium (Mg)7439-95-40.001430.149200.05978
Nickel (Ni)7440-02-00.028642.983701.19547
Silicon (Si)7440-21-30.006210.646500.25903
Pure metal layerGold (Au)7440-57-50.000110.011400.00457
Nickel (Ni)7440-02-00.004760.495500.19853
Palladium (Pd)7440-05-30.000340.035700.01430
Mould CompoundFillerSilica -amorphous-7631-86-90.2599023.0000010.84725
Silica fused60676-86-00.6780060.0000028.29716
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.033903.000001.41486
Ion trapping agentBismuth (Bi)7440-69-90.005650.500000.23581
PigmentCarbon black1333-86-40.005650.500000.23581
PolymerEpoxy resin systemProprietary0.079107.000003.30134
Phenolic resinProprietary0.067806.000002.82972
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000030.055500.00116
Tin solderTin (Sn)7440-31-50.0499799.940002.08556
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0160099.990000.66771
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.