Chemical content BC856BMB

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Type numberPackagePackage descriptionTotal product weight
BC856BMBSOT883B dummy POVXQFN30.67843 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340695433152126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33607
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04630
Phenolic resinProprietary0.0004113.530000.05983
DieDoped siliconSilicon (Si)7440-21-30.03000100.000004.42197
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09905
Copper (Cu)7440-50-80.2632094.0000038.79545
Tin (Sn)7440-31-50.000670.240000.09905
Zinc (Zn)7440-66-60.000590.210000.08667
Pure metal layerGold (Au)7440-57-50.000220.080000.03302
Nickel (Ni)7440-02-00.013834.940002.03882
Palladium (Pd)7440-05-30.000810.290000.11969
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.52661
Silica fused60676-86-00.2040060.0000030.06942
Flame retardantMetal hydroxideProprietary0.010203.000001.50347
ImpurityBismuth (Bi)7440-69-90.001700.500000.25058
PigmentCarbon black1333-86-40.001700.500000.25058
PolymerEpoxy resin systemProprietary0.023807.000003.50810
Phenolic resinProprietary0.020406.000003.00694
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00164
Tin solderTin (Sn)7440-31-50.0199999.940002.94621
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0054399.990000.80015
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.