Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC856BQB-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC856BQB-QSOT8015DFN1110D-31.602181 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664000147112601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00532076.0000000.332047
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00073310.4700000.045744
Phenolic resinProprietary0.00094713.5300000.059113
subTotal0.007000100.0000000.436904
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000001.872448
subTotal0.030000100.0000001.872448
Lead FrameCopper alloyCopper (Cu)7440-50-80.71880795.58600044.864264
Magnesium (Mg)7439-95-40.0011200.1490000.069935
Nickel (Ni)7440-02-00.0224162.9809001.399116
Silicon (Si)7440-21-30.0048570.6459000.303160
Pure metal layerGold (Au)7440-57-50.0000580.0077000.003614
Nickel (Ni)7440-02-00.0044670.5940000.278800
Palladium (Pd)7440-05-30.0002740.0365000.017132
subTotal0.752000100.00000046.936020
Mould CompoundFillerSilica -amorphous-7631-86-90.0600107.9800003.745494
Silica fused60676-86-00.60229280.09200037.591997
PigmentCarbon black1333-86-40.0069790.9280000.435566
PolymerEpoxy resin systemProprietary0.0635448.4500003.966094
Phenolic resinProprietary0.0191762.5500001.196869
subTotal0.752000100.00000046.936020
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000160
Non hazardousProprietary0.0000320.0555000.001974
Tin solderTin (Sn)7440-31-50.05696699.9400003.555516
subTotal0.057000100.0000003.557650
WireImpurityNon hazardousProprietary0.0000000.0100000.000026
Pure metalCopper (Cu)7440-50-80.00418199.9900000.260931
subTotal0.004181100.0000000.260957
total1.602181100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.