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Chemical content BC857CQB-Q

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Type numberPackagePackage descriptionTotal product weight
BC857CQB-QSOT8015DFN1110D-31.60226 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662722147312601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0053276.000000.33203
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0007310.470000.04574
Phenolic resinProprietary0.0009513.530000.05911
subTotal0.00700100.000000.43688
DieDoped siliconSilicon (Si)7440-21-30.03000100.000001.87236
subTotal0.03000100.000001.87236
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860044.86205
Magnesium (Mg)7439-95-40.001120.149000.06993
Nickel (Ni)7440-02-00.022422.980901.39905
Silicon (Si)7440-21-30.004860.645900.30314
Pure metal layerGold (Au)7440-57-50.000060.007700.00361
Nickel (Ni)7440-02-00.004470.594000.27879
Palladium (Pd)7440-05-30.000270.036500.01713
subTotal0.75200100.0000046.93370
Mould CompoundFillerSilica -amorphous-7631-86-90.060017.980003.74531
Silica fused60676-86-00.6022980.0920037.59014
PigmentCarbon black1333-86-40.006980.928000.43554
PolymerEpoxy resin systemProprietary0.063548.450003.96590
Phenolic resinProprietary0.019182.550001.19681
subTotal0.75200100.0000046.93370
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00197
Tin solderTin (Sn)7440-31-50.0569799.940003.55534
subTotal0.05700100.000003.55747
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0042599.990000.26554
subTotal0.00426100.000000.26557
total1.60226100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.