Chemical content BC857QAS

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Type numberPackagePackage descriptionTotal product weight
BC857QASSOT1216DFN1010B-61.21404 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934068723147412601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000201.000000.01647
FillerSilver (Ag)7440-22-40.0168084.000001.38381
PolymerBismaleimidodiphenylmethane resin 0.0020010.000000.16474
Isobornyl Methacrylate7534-94-30.001005.000000.08237
DieDoped siliconSilicon (Si)7440-21-30.06000100.000004.94218
Lead FrameCopper alloyChromium (Cr)7440-47-30.001180.240000.09687
Copper (Cu)7440-50-80.4649694.8900038.29866
Tin (Sn)7440-31-50.001180.240000.09687
Zinc (Zn)7440-66-60.001030.210000.08476
Pure metal layerGold (Au)7440-57-50.000240.050000.02018
Nickel (Ni)7440-02-00.020584.200001.69517
Palladium (Pd)7440-05-30.000830.170000.06861
Mould CompoundFillerSilica -amorphous-7631-86-90.1403023.0000011.55646
Silica fused60676-86-00.3660060.0000030.14728
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.018303.000001.50736
Ion trapping agentBismuth (Bi)7440-69-90.003050.500000.25123
PigmentCarbon black1333-86-40.003050.500000.25123
PolymerEpoxy resin systemProprietary0.042707.000003.51718
Phenolic resinProprietary0.036606.000003.01473
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00007
Non hazardousProprietary0.000010.055500.00091
Tin solderTin (Sn)7440-31-50.0199999.940001.64640
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0140499.990001.15653
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.