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Chemical content BCM847QAS

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Type numberPackagePackage descriptionTotal product weight
BCM847QASSOT1216DFN1010B-61.21532 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934071231147312601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01810
FillerSilver (Ag)7440-22-40.0184884.000001.52059
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.18102
Isobornyl Methacrylate7534-94-30.001105.000000.09051
subTotal0.02200100.000001.81022
DieDoped siliconSilicon (Si)7440-21-30.06000100.000004.93697
subTotal0.06000100.000004.93697
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.83752
Magnesium (Mg)7439-95-40.000830.170000.06868
Nickel (Ni)7440-02-00.013942.840001.14739
Silicon (Si)7440-21-30.003040.620000.25049
Pure metal layerGold (Au)7440-57-50.000340.070000.02828
Nickel (Ni)7440-02-00.023034.690001.89480
Palladium (Pd)7440-05-30.002110.430000.17372
subTotal0.49100100.0000040.40088
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.46858
Silica fused60676-86-00.3636060.0000029.91805
Flame retardantMetal hydroxideProprietary0.018183.000001.49590
ImpurityBismuth (Bi)7440-69-90.003030.500000.24932
PigmentCarbon black1333-86-40.003030.500000.24932
PolymerEpoxy resin systemProprietary0.042427.000003.49044
Phenolic resinProprietary0.036366.000002.99180
subTotal0.60600100.0000049.86341
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00110
Tin solderTin (Sn)7440-31-50.0239999.940001.97360
subTotal0.02400100.000001.97479
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0123299.990001.01379
subTotal0.01232100.000001.01389
total1.21532100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.