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Chemical content BCM857QAS

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Type numberPackagePackage descriptionTotal product weight
BCM857QASSOT1216DFN1010B-61.21538 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660013147312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01810
FillerSilver (Ag)7440-22-40.0184884.000001.52051
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.18101
Isobornyl Methacrylate7534-94-30.001105.000000.09051
subTotal0.02200100.000001.81013
DieDoped siliconSilicon (Si)7440-21-30.06000100.000004.93673
subTotal0.06000100.000004.93673
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.83571
Magnesium (Mg)7439-95-40.000830.170000.06868
Nickel (Ni)7440-02-00.013942.840001.14733
Silicon (Si)7440-21-30.003040.620000.25047
Pure metal layerGold (Au)7440-57-50.000340.070000.02828
Nickel (Ni)7440-02-00.023034.690001.89471
Palladium (Pd)7440-05-30.002110.430000.17372
subTotal0.49100100.0000040.39890
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.46802
Silica fused60676-86-00.3636060.0000029.91657
Flame retardantMetal hydroxideProprietary0.018183.000001.49583
ImpurityBismuth (Bi)7440-69-90.003030.500000.24930
PigmentCarbon black1333-86-40.003030.500000.24930
PolymerEpoxy resin systemProprietary0.042427.000003.49027
Phenolic resinProprietary0.036366.000002.99166
subTotal0.60600100.0000049.86095
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00110
Tin solderTin (Sn)7440-31-50.0239999.940001.97351
subTotal0.02400100.000001.97470
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0123899.990001.01876
subTotal0.01238100.000001.01886
total1.21538100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.