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Chemical content BCV61B

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
BCV61BSOT143BSOT48.91408 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93379211023513126030 s123520 s3D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
93379211021512126030 s123520 s3Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08000100.000000.89746
subTotal0.08000100.000000.89746
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002700.080000.03024
Carbon (C)7440-44-00.001350.040000.01512
Chromium (Cr)7440-47-30.007080.210000.07939
Cobalt (Co)7440-48-40.014150.420000.15878
Iron (Fe)7439-89-61.5933447.2800017.87437
Manganese (Mn)7439-96-50.028640.850000.32135
Nickel (Ni)7440-02-01.2003935.6200013.46627
Phosphorus (P)7723-14-00.000670.020000.00756
Silicon (Si)7440-21-30.008760.260000.09829
Sulphur (S)7704-34-90.000670.020000.00756
Pure metal layerCopper (Cu)7440-50-80.4408013.080004.94494
Silver (Ag)7440-22-40.071442.120000.80147
subTotal3.37000100.0000037.80534
Mould CompoundFillerSilica fused60676-86-03.5287071.0000039.58569
PigmentCarbon black1333-86-40.014910.300000.16726
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9790919.7000010.98363
Phenolic resinProprietary0.447309.000005.01790
subTotal4.97000100.0000055.75448
Post-PlatingImpurityAntimony (Sb)7440-36-00.000050.010000.00053
Bismuth (Bi)7440-69-90.000090.020000.00105
Iron (Fe)7439-89-60.000050.010000.00053
Lead (Pb)7439-92-10.000050.010000.00053
Tin solderTin (Sn)7440-31-50.4697699.950005.26992
subTotal0.47000100.000005.27256
WirePure metalGold (Au)7440-57-50.02408100.000000.27013
subTotal0.02408100.000000.27013
total8.91408100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.