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Chemical content BSH105

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Type numberPackagePackage descriptionTotal product weight
BSH105SOT23TO-236AB8.18163 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340547152351712601235Manchester, United Kingdom; Dongguan, China; Sherman, United States Of America 
9340547152151412601235Dongguan, China; Manchester, United Kingdom; Sherman, United States Of America 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.38603100.000004.71831
subTotal0.38603100.000004.71831
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002460.090000.03011
Carbon (C)7440-44-00.001090.040000.01338
Chromium (Cr)7440-47-30.006020.220000.07360
Cobalt (Co)7440-48-40.011770.430000.14385
Iron (Fe)7439-89-61.3132147.9800016.05075
Manganese (Mn)7439-96-50.023540.860000.28770
Nickel (Ni)7440-02-00.9891536.1400012.08991
Phosphorus (P)7723-14-00.000550.020000.00669
Silicon (Si)7440-21-30.007120.260000.08698
Sulphur (S)7704-34-90.000550.020000.00669
Pure metal layerCopper (Cu)7440-50-80.3112011.370003.80361
Silver (Ag)7440-22-40.070342.570000.85974
subTotal2.73700100.0000033.45301
Mould CompoundFillerSilica fused60676-86-03.4349871.0000041.98405
PigmentCarbon black1333-86-40.014510.300000.17740
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9530919.7000011.64910
Phenolic resinProprietary0.435429.000005.32192
subTotal4.83800100.0000059.13247
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000110.055500.00129
Tin solderTin (Sn)7440-31-50.1898999.940002.32088
subTotal0.19000100.000002.32227
WirePure metalGold (Au)7440-57-50.03060100.000000.37401
subTotal0.03060100.000000.37401
total8.18163100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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