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Chemical content BSH205G2

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Type numberPackagePackage descriptionTotal product weight
BSH205G2SOT23TO-236AB8.92452 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068496235412601235Dongguan, China; Hsin-chu, Taiwan 
934068496215312601235Dongguan, China; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34512
PolymerResin systemProprietary0.0092023.000000.10309
subTotal0.04000100.000000.44821
DieDoped siliconSilicon (Si)7440-21-30.16000100.000001.79281
subTotal0.16000100.000001.79281
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.70077
Iron (Fe)7439-89-60.082912.520000.92899
Lead (Pb)7439-92-10.000990.030000.01106
Phosphorus (P)7723-14-00.004940.150000.05530
Zinc (Zn)7440-66-60.006250.190000.07004
Pure metal layerSilver (Ag)7440-22-40.098042.980001.09857
subTotal3.29000100.0000036.86473
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23292
FillerSilica -amorphous-7631-86-90.014700.290000.16475
Silica fused60676-86-04.3678086.1500048.94162
HardenerPhenolic resinProprietary0.217504.290002.43714
PigmentCarbon black1333-86-40.009630.190000.10794
PolymerEpoxy resin systemProprietary0.439578.670004.92541
subTotal5.07000100.0000056.80978
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000190.055500.00218
Tin solderTin (Sn)7440-31-50.3497999.940003.91943
subTotal0.35000100.000003.92179
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0145199.990000.16264
subTotal0.01452100.000000.16266
total8.92452100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.