Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BSH205G2

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BSH205G2SOT23TO-236AB8.924516 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340684962354126030 s123520 s3
9340684962153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.03080077.0000000.345117
PolymerResin systemProprietary0.00920023.0000000.103087
subTotal0.040000100.0000000.448204
DieDoped siliconSilicon (Si)7440-21-30.160000100.0000001.792814
subTotal0.160000100.0000001.792814
Lead FrameCopper alloyCopper (Cu)7440-50-83.09687794.13000034.700784
Iron (Fe)7439-89-60.0829082.5200000.928992
Lead (Pb)7439-92-10.0009870.0300000.011059
Phosphorus (P)7723-14-00.0049350.1500000.055297
Zinc (Zn)7440-66-60.0062510.1900000.070043
Pure metal layerSilver (Ag)7440-22-40.0980422.9800001.098569
subTotal3.290000100.00000036.864744
Mould CompoundAdditiveNon hazardousProprietary0.0207870.4100000.232920
FillerSilica -amorphous-7631-86-90.0147030.2900000.164748
Silica fused60676-86-04.36780586.15000048.941646
HardenerPhenolic resinProprietary0.2175034.2900002.437141
PigmentCarbon black1333-86-40.0096330.1900000.107939
PolymerEpoxy resin systemProprietary0.4395698.6700004.925410
subTotal5.070000100.00000056.809803
Post-PlatingImpurityLead (Pb)7439-92-10.0000160.0045000.000176
Non hazardousProprietary0.0001940.0555000.002177
Tin solderTin (Sn)7440-31-50.34979099.9400003.919428
subTotal0.350000100.0000003.921781
WireImpurityNon hazardousProprietary0.0000010.0100000.000016
Pure metalCopper (Cu)7440-50-80.01451599.9900000.162637
subTotal0.014516100.0000000.162653
total8.924516100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.