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Chemical content BSP250

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Type numberPackagePackage descriptionTotal product weight
BSP250dummy POV SOT223SC-73103.60406 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340334501351312601235Dongguan, China; Manchester, United Kingdom 
9340334501151412601235Dongguan, China; Manchester, United Kingdom 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1001077.000000.09662
PolymerResin systemProprietary0.0299023.000000.02886
subTotal0.13000100.000000.12548
DieDoped siliconSilicon (Si)7440-21-31.14351100.000001.10373
subTotal1.14351100.000001.10373
Lead FrameCopper alloyCopper (Cu)7440-50-850.7251499.1500048.96057
Iron (Fe)7439-89-60.051160.100000.04938
Phosphorus (P)7723-14-00.015350.030000.01481
Pure metal layerSilver (Ag)7440-22-40.368350.720000.35554
subTotal51.16000100.0000049.38030
Mould CompoundFillerSilica fused60676-86-034.6409071.0000033.43585
PigmentCarbon black1333-86-40.146370.300000.14128
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-29.6116319.700009.27727
Phenolic resinProprietary4.391109.000004.23835
subTotal48.79000100.0000047.09275
Post-PlatingImpurityLead (Pb)7439-92-10.000100.004500.00010
Non hazardousProprietary0.001230.055500.00118
Tin solderTin (Sn)7440-31-52.2086799.940002.13184
subTotal2.21000100.000002.13312
WirePure metalGold (Au)7440-57-50.17055100.000000.16462
subTotal0.17055100.000000.16462
total103.60406100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.