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Chemical content BSS84AKMB

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Type numberPackagePackage descriptionTotal product weight
BSS84AKMBSOT883BXQFN30.69002 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065863315712601235Dongguan, China; Kyoto, Japan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33043
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04552
Phenolic resinProprietary0.0004113.530000.05882
subTotal0.00300100.000000.43477
DieDoped siliconSilicon (Si)7440-21-30.0364191.030005.27695
Gold alloyAluminium (Al)7429-90-50.002576.430000.37274
Gold (Au)7440-57-50.001022.540000.14724
subTotal0.04000100.000005.79693
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09739
Copper (Cu)7440-50-80.2632094.0000038.14382
Tin (Sn)7440-31-50.000670.240000.09739
Zinc (Zn)7440-66-60.000590.210000.08521
Pure metal layerGold (Au)7440-57-50.000220.080000.03246
Nickel (Ni)7440-02-00.013834.940002.00458
Palladium (Pd)7440-05-30.000810.290000.11768
subTotal0.28000100.0000040.57853
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.33300
Silica fused60676-86-00.2040060.0000029.56436
Flame retardantMetal hydroxideProprietary0.010203.000001.47822
ImpurityBismuth (Bi)7440-69-90.001700.500000.24637
PigmentCarbon black1333-86-40.001700.500000.24637
PolymerEpoxy resin systemProprietary0.023807.000003.44918
Phenolic resinProprietary0.020406.000002.95644
subTotal0.34000100.0000049.27394
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00161
Tin solderTin (Sn)7440-31-50.0199999.940002.89673
subTotal0.02000100.000002.89847
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0070199.990001.01654
subTotal0.00701100.000001.01664
total0.69002100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.