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Chemical content BSS84AKQB

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Type numberPackagePackage descriptionTotal product weight
BSS84AKQBSOT8015DFN1110D-31.60200 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660937147212601235Kyoto, Japan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0045676.000000.28464
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0006310.470000.03921
Phenolic resinProprietary0.0008113.530000.05067
subTotal0.00600100.000000.37452
DieDoped siliconSilicon (Si)7440-21-30.0364191.030002.27291
Gold alloyAluminium (Al)7429-90-50.002576.430000.16055
Gold (Au)7440-57-50.001022.540000.06342
subTotal0.04000100.000002.49688
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860044.86933
Magnesium (Mg)7439-95-40.001120.149000.06994
Nickel (Ni)7440-02-00.022422.980901.39927
Silicon (Si)7440-21-30.004860.645900.30319
Pure metal layerGold (Au)7440-57-50.000060.007700.00361
Nickel (Ni)7440-02-00.004470.594000.27883
Palladium (Pd)7440-05-30.000270.036500.01713
subTotal0.75200100.0000046.94130
Mould CompoundAdditiveNon hazardousProprietary0.003030.410000.18913
FillerSilica -amorphous-7631-86-90.002140.290000.13378
Silica fused60676-86-00.6366586.1500039.74086
HardenerPhenolic resinProprietary0.031704.290001.97897
PigmentCarbon black1333-86-40.001400.190000.08765
PolymerEpoxy resin systemProprietary0.064078.670003.99946
subTotal0.73900100.0000046.12985
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00197
Tin solderTin (Sn)7440-31-50.0569799.940003.55592
subTotal0.05700100.000003.55805
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0080099.990000.49933
subTotal0.00800100.000000.49938
total1.60200100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.